Exhibition News 2025/10/28
**Presenting Proven Results of HLC Drilling Technology**
• High-performance AI server micro-drilling solutions
• High-speed, high-precision drilling technology for ABF/FC substrates
• Q-grade glass fabric multilayer board applications
• Back-drilling processes for enhanced high-speed signal integrity
• High-strength micro drill bits for low-orbit satellites, in total, ten key product topics will be showcased.
Exhibition Information: October 28–30, 2025
Location: Shenzhen World Exhibition & Convention Center (Baoan) Booth: 8C25
2025 Electronic Semiconductor Industry Innovation & Development Conference and International Electronics Circuit Exhibition
(Greater Bay Area)